IC Elektronika predstavlja nVent SCHROFF: Sustainable and future ready cooling solutions
Data centers have evolved in recent years. Organizations recognize the technical and business value of deploying modular, scalable, and more precisely defined infrastructure. This value comes from repeatable, pre-configured and quality-assured components that grow with business and IT growth. However, growth is not exclusively in DC space or installations. Heat load is increasing along with packing density. So how can you ensure that energy costs remain manageable as IT infrastructure grows, while ensuring data availability at all times? In this session we will have a look at traditional ways of cooling and new technologies as direct to chip or immersion cooling.
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